Thermal Systems Integration Engineer-Advanced Packaging

We're looking for a Thermal Systems Integration Engineer to serve as the primary technical partner for customers as they evaluate and adopt high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.

RESPONSIBILITIES:

• Act as the primary technical point of contact for ODM, OSAT, and hyperscaler engineering teams during early and mid-stage engagement.
• Work closely with business development to uncover and document customer requirements, including thermal budgets, reliability standards, and process/package constraints.
• Lead internal scoping and coordination of customer-specific technical work, including reliability testing, and evaluation of alternative product variants, compliance ranges, or gaskets.
• Prepare and deliver technical collateral such as application notes, design guides, and data reports to support customer decision-making and qualification processes.
• Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.
• Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.
• Partner with sales and business development teams to provide pre-sales technical support and contribute to the overall customer success strategy.
• Gather and synthesize customer feedback (e.g., on performance, handling, supply chain needs) and bring it back to the product team.

BACKGROUND PROFILE:

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 3–7 years of experience in semiconductor packaging, thermal interface materials, or applications engineering in a B2B technical product company.
• Strong understanding of semiconductor packaging processes (flip-chip, 2.5D/3D integration, TIM1/TIM1.5/TIM2) and associated reliability testing (uHAST, TCT, HTS, etc.).
• Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.
• Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.
• Hands-on experience with lab testing, data analysis, and report generation; familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.