Scientist-Thermal Interface Materials

RESPONSIBILITIES:

• Develop and execute R&D strategies and technology roadmaps for next-generation electronic materials.
• Lead the development and scale-up of advanced adhesive technologies using DoE, modeling, and process optimization.
• Mentor junior scientists and foster a culture of technical excellence and continuous learning.
• Drive collaborative innovation with global customers, academic institutions, and external partners.
• Analyze complex technical challenges, identify root causes, and implement risk-mitigating solutions.
• Build and manage a strategic IP portfolio to secure competitive advantages.
• Represent the organization at international conferences and industry forums to enhance technical visibility.

BACKGROUND PROFILE:

• PhD or equivalent expertise in Chemistry, Chemical Engineering, Polymer Science, or Materials Science.
• 5+ years of industry experience in product development for electronic materials and adhesive technologies.
• Deep expertise in thermoset systems, high-reliability adhesives, and interface engineering for microelectronics.
• Strong communication and influence skills, with the ability to translate technical insights into strategic direction.
• Advanced proficiency in experimental design, statistical modeling, and high-throughput screening.
• Proven leadership in lab operations, safety culture, and mentoring of junior scientists.
• Demonstrated ability to lead multiple high-impact projects with strategic prioritization and cross-functional alignment.