Thermal Imaging Platform Architect

  Position Summary: The Thermal Imaging Technology Platform Architect is an enterprise technical leader responsible for connecting customer system requirements, market opportunities, and technology platform capabilities in thermal imaging. Blending deep engineering expertise with business strategy, this role serves as the primary technical interface for customers and ecosystem partners during opportunity development, technology definition, and platform adoption activities.  Working closely with Business Unit leadership, Platform Managers, Sales, and Technology Development teams, the Technology Platform Architect translates customer and market requirements into actionable development priorities and solutions.  The role combines technical leadership, customer engagement, and market insight to ensure SkyWater technologies remain aligned with evolving customer needs and emerging market opportunities. This opportunity can be a remote or hybrid position.   Major Areas of Accountability: Lead technical discoveries with customers and ecosystem partners and assess solution fit.  Define solution architectures and translate requirements into scopes of work. Drive internal scoping, prioritization, and opportunity reviews. Lead enterprise-level customer system  understanding and  technology tradeoffs across the entire Thermal Imaging platform. Support platform strategy with customer and market insights. Produce technical content and reference architecture for sales, marketing, and onboarding including white papers and conference presentations. Serve as the primary technical interface from concept to project kickoff Demonstrate SkyWater capabilities, support key customer technical issue resolutions, and advance opportunities Build strong customer relationships to position SkyWater as a trusted partner. Collaborate with sales, engineering, and business teams to align solutions. Lead creation of proposals and SOWs aligned with customer and business goals. Required Qualifications: Education: BS required in Engineering, Physics or Material Science. 8-12 years plus of progressive experience in field applications, design, or process development/integration within the semiconductor industry preferably in foundries. Required experience in Analog, Mixed Signal, ASIC design, ideally with 90nm and 130nm CMOS nodes technologies, demonstrating a deep understanding of the challenges and opportunities these older technologies present. Demonstrated impact on platform revenue. Led multiple development programs from concept through qualification. Deep domain expertise in assigned platform or market including a strong understanding of semiconductor technology development and commercialization. Able to lead customer and industry discussions uncovering system level requirements via technical discovery workshops, document results, and turn into requirements to support technology development. Ability to translate ambiguous customer needs into structured project requirements. Strong customer-facing communication skills. Travel Requirements: 25%. Working knowledge/experience with Cadence Tool set for PDKs, layout, DRCs. Analog & Mixed Signal IC design experience (in addition to reference to ASIC design). Experience working with 3rd party partners: Tool vendors, Design Partners, IP provider. US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.    Preferred Qualifications: Education. MS preferred.  Engineering, physics, material science.   5+ years in system architecture or product design in assigned area. Working knowledge/experience with Cadence Tool set for PDKs, layout, DRCs. Analog & Mixed Signal IC design experience (in addition to reference to ASIC design). Experience working with 3rd party partners: Tool vendors, Design Partners, and IP providers. Participation in industry groups and ability to present to Executive level. Platform or Product Launch Experience. Regulated/Defense.