Thermal Engineer (Level 3)
Northrop GrummanDescription
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.Northrop Grumman’s Electronics and Payloads Electromechanical Technology Department is seeking a Principal Thermal Design and Analysis Engineer to join our high performance team.
The qualified candidate will work with a diverse and talented team of engineers helping to develop, analyze, and test everything from electronic components through hardware and integrated systems in support of a broad range of products and business areas within the Space Systems Sector. The candidate will support the design, analysis, and test of space hardware and associated support equipment for antennas / electro-optical sensors, sensor structures, electronics chassis, circuit card assemblies, modules, and electronic subassemblies and components.
The Thermal Design and Analysis Engineer will be involved during all phases of program development from concept design through hardware integration and test efforts, with responsibilities ranging from design inputs, completing thermal analyses, presenting at design reviews, writing test reports, and helping with product test planning and execution. This role will work out of Baltimore, MD.
Typical roles and responsibilities include, but are not limited to:
Performing steady state and transient thermal analyses of component, hardware, and assembly designs to evaluate thermal performance, select thermal components, and evaluate thermal margins for operation within the space environment
Creating system level thermal models of assemblies and detailed thermal models of subassemblies and individual parts, including thermal models of circuit card assemblies down to the component junction level
Understanding mechanical requirements and environments of space program hardware or subsystems of major satellite programs to assure technical performance is achieved
Preparing material and presenting at internal program, customer, and/or supplier technical exchange meetings and formal program milestone reviews
Provide technical guidance to programs and engineering teams in thermal related activities and mentor junior design and analysis engineers
Ability to maintain a diverse workload, work independently, and collaborate as part of a cross-functional team with other engineers, management and contractors.
Support design verification and test planning, troubleshoot integration issues, and execute thermal test campaigns to evaluate and sell off hardware designs
Basic Qualifications:
Bachelors of Science in: Mechanical Engineering, Aerospace Engineering, Physics or related field with 5 years of experience, a M.S Degree with 3 years of experience or a Ph. D with 1 years of experience. Post graduate work will be considered.
Working knowledge of thermal analysis software (IcePak, Sinda/Fluint, Thermal Desktop) or similar.
Strong problem solving and analytical skills.
Ability to communicate effectively to team members both verbally and in writing.
No clearance required to start, but must be eligible to obtain and maintain a TS/SCI security clearance.
U.S. citizenship
Preferred Qualifications:
Design and analysis experience simulating heat transfer of electromechanical assemblies in Space environments.