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Thermal Engineer

Apple
1 day ago
On-site
Shanghai, Shanghai, United States
Thermography (Thermal Imaging)
The people here at Apple don"t just build products - they build the kind of wonder that"s revolutionized entire industries. It"s the diversity of those people and their ideas that encourages the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Apple, and help us leave the world better than we found it.\\n\\nJoin Apple"s Thermal Design group as an experienced Thermal Engineer in Asia!

In this role, you"ll be the in-region thermal expert, utilizing your deep knowledge of system-level and module-level thermal design and validation. \\nCollaboration is key, as you"ll work closely with U.S.-based peers on technology evaluation, design investigation, and process development for new products. \\nResponsibilities also include guiding and executing thermal testing at OEM and supplier factories, from test setup, data analysis to report preparation. Experience in passive device thermal design is highly valued.\\nEstablish and manage relationships with thermal suppliers to identify emerging technologies and collaborate on developing innovative solutions aligned with Apple"s product roadmap needs.\\nLead the way in suggesting and adopting innovative ideas to improve the productivity and quality of thermal components.\\nProvide in-region expertise for root cause analysis and corrective action of system thermal failures and defective thermal parts/materials.\\nTrain engineers at OEM and vendor factories to produce high-quality products using well-defined specifications, advanced production processes, and up-to-date validation tools and codes.

BS or MS in Mechanical Engineering or related field.\\n1-5 years experience in passive thermal design of consumer electronics with a strong background in thermal systems/components and their manufacturing processes.\\nExperience with thermal testing and test equipment (DAQ, wind tunnel, IR camera, power supplies, RF, etc.).\\nFrequent travel to India is required.

Excellent written and oral communication skills for effective collaboration between design, OEM, and third-party vendor teams.\\nCoding skills (C++, Perl, Python, etc.) are a plus.\\nExperience with thermal analysis using CFD tools is a plus.