The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.
BS + 10 years of industry experience.
MSEE + 10 years of industry experience.
Extensive experience in thermal design, analysis and validation of advanced cooling solutions for high power SOC.
Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk, etc.
Experience of experimental setup and data collection.