This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance, Developing detailed and reduced-order thermal models, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.
BSEE + 3 years of industry experience.
MSEE +3 years of industry experience.
Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices.
Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk etc.
Experience of data center cooling solution analysis, design and test.
Experience of experimental setup and data collection.